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Package: Vial ; Diameter: 0.9 mm ; Alloy composition: 59.5 ... 60.5 % Sn 38.8 ... 40.5 % Pb ; Flux: SW26 ; Flux content in solder: 2.5 % ; Weight: 16 g ;
| Package: | Vial |
| Diameter: | 0.9 mm |
| Alloy composition: | 59.5 ... 60.5 % Sn 38.8 ... 40.5 % Pb < 0.7 % others |
| Melting temperature: | 183 / 190 °C (solidus/liquidus) |
| Density: | 8.50 g/cm3 |
| Electrical resistivity: | 0.153 μΩ·m |
| Thermal conductivity: | 49 W/(m·K) |
| Suggested soldering tip temperature: | 340 °C ... 420 °C |
| Flux: | SW26 |
| Flux content in solder: | 2.5 % ± 0.2 % |
| Flux solubility: | Organic solvents (e.g. isopropanol) |
| Weight: | 16 g |
| Manufacturer / Brand: | Cynel Unipress |
| Guarantee: | 2 years |
Brand:
Cynel